"TI has developed a device screening specification called 'Space High Performance Plastic' ['SHP'] for radiation-hardened products and submitted ADCs that meet SHP qualifications," according to the company. “TI also introduced product families to radiation-resistant package Space EP ['enhanced plastic']."
The SHP specification includes BGA packages for radiation shielded semiconductors.
The 10 x 10 x 1.9 mm flip chip BGAs contain RHA (radiation tolerance) ADCs with a communication speed of 17.1 Gbps:
Source: electronicsweekly.com
